This Video is Uploaded by jgluckibm, London: Get ready for the next-generation computers and smart-phones that are up to 1,000 times faster than the systems you use today. Computer maker IBM is developing
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"skyscraper" computers using huge sandwiches of silicon chips by sticking layer after layer of chips covered with tiny 3M currently makes heat resistant glues, adhesives used in the aerospace industry and sticky tapes, but the hi-tech glues created for IBM could actually be the key step towards making the next evolutionary leap in computing, the Daily Mail reported. Read Full: By 2013, computers will be 1,000 times faster
